JOURNAL OF SHANDONG UNIVERSITY (ENGINEERING SCIENCE) ›› 2017, Vol. 47 ›› Issue (3): 143-150.doi: 10.6040/j.issn.1672-3961.0.2017.030

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Preparation and optimization of compound bonded material used in reducing the contact thermal resistance

DONG Zhen1,2, YANG Yonglu2, XIONG Guodong2, LAI Yanhua1, 2*, LYU Mingxin1,2   

  1. 1. Suzhou Institute, Shandong University, Suzhou 215028, Jiangsu, China;
    2. School of Energy and Power Engineering, Shandong University, Jinan 250061, Shandong, China
  • Received:2017-01-16 Online:2017-06-20 Published:2017-01-16

Abstract: To enhance the global thermal conductivity of adsorbed bed, heating resistingand corrosion-resistant composite bonded material with high thermal conductivity was studied. It could be daubed between adsorbed bed and adsorbent for decreasing thermal contact resistance.The article experimental researched the influence of thermal conducting filler, diluent and coupling reagent and other factors on composite bonded materials thermal conductivity at first. And then confecting project of composite bonded material with orthogonal experiment was optimized. The research results showed that the thermal properties of the compositebonded material improved with the percentage of thethermal conducting filler Al2O3 increasing, composites with 10 μm Al2O3 fillers had better thermal performance than the composites with 35 μm Al2O3fillers.For 10 μm Al2O3 fillers, which treated by 8% concentration coupling agent had the highest thermal conductivity.The thermal conductivity of the composites could be significantly improved by using the appropriate ratio of the thermal conductive fillers, diluents and coupling agents.

Key words: compositebonded material, thermal conductivity, thermal contact resistance, preparationoptimization, orthogonal experiment

CLC Number: 

  • TK124
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