@article{DONG Zhen:143, author = {DONG Zhen, YANG Yonglu, XIONG Guodong, LAI Yanhua, LYU Mingxin}, title = {Preparation and optimization of compound bonded material used in reducing the contact thermal resistance}, publisher = {Journal of Shandong University(Engineering Science)}, year = {2017}, journal = {Journal of Shandong University(Engineering Science)}, volume = {47}, number = {3}, eid = {143}, numpages = {7}, pages = {143}, keywords = {compositebonded material;thermal conductivity;thermal contact resistance;orthogonal experiment;preparationoptimization}, url = {http://gxbwk.njournal.sdu.edu.cn/EN/abstract/article_1614.shtml}, doi = {10.6040/j.issn.1672-3961.0.2017.030} }