JOURNAL OF SHANDONG UNIVERSITY (ENGINEERING SCIENCE)
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CAO Ning1, LI Mu-sen1, MA Quan-sheng2, HAO Guang-zheng3, BAI Yun-qiang1
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| [1] | DONG Zhen, YANG Yonglu, XIONG Guodong, LAI Yanhua, LYU Mingxin. Preparation and optimization of compound bonded material used in reducing the contact thermal resistance [J]. JOURNAL OF SHANDONG UNIVERSITY (ENGINEERING SCIENCE), 2017, 47(3): 143-150. |
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