The mechanical characteristics and microstructure of the partial liquid phase diffusing bonding joint of Si3N4/(Cu,Nb)/Ni/Inconel600high temperature alloy
- YANG Min,ZOU Zeng-da,SONG Wen-peng,SUN Xiao-lei
JOURNAL OF SHANDONG UNIVERSITY (ENGINEERING SCIENCE). 2007, 37(6):
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In order to obtain ceramic/metal joint with excellent high temperature properties under lower bonding temperature, less bonding pressure and short bonding time, the partial liquid phase diffusion bonding (PLPDB) of Si3N4/Inconel 600 has been conducted in vacuum diffusing bonding machine through asymmetric interlayer design. The bonding time, pressure and cooling velocity were 50min, 7.5MPa and 10K/min, respectively, and the bonding temperature varied from 1373K to 1403K. While the strength of joint was evaluated by shear test, the microstructure of joint was observed and analyzed by scanning electron microscope. Results show that the thickness of (Nb，Cu) layer, the ratio of Cu to Nb and bonding temperature affect the microstructure, strength and fracture of joint. When the bonding temperature was 1403K, the increase of Cu to Nb ratio resulted in the reduction of porosities in joint, increase of joint strength and change of the fracture location from the interface between ceramic and interlayer to ceramic. When the bonding temperature is 1403K, the ratio of Cu to Nb is 10 and the thickness of (Cu,Nb) layer isless than 0.2mm, the strength of joint is raised while the thickness of (Cu, Nb) layer got thicker. The strength of joint rose obviously while the bonding temperature fell from 1403K to 1373K.