Si3N4/（Cu，Nb）/Ni/Inconel600高温合金部分液相扩散连接接头的组织与力学性能

山东大学学报(工学版)

Si₃N₄/（Cu，Nb）/Ni/Inconel600高温合金部分液相扩散连接接头的组织与力学性能

杨敏，邹增大，宋文鹏，孙小磊

山东大学材料科学与工程学院，山东济南250061

收稿日期:2007-04-03 修回日期:1900-01-01 出版日期:2007-12-24 发布日期:2007-12-24
通讯作者: 杨敏

The mechanical characteristics and microstructure of the partial liquid phase diffusing bonding joint of Si₃N₄/(Cu,Nb)/Ni/Inconel600high temperature alloy

YANG Min，ZOU Zeng-da，SONG Wen-peng，SUN Xiao-lei

School of Materials Science and Engineering，Shandong University，Jinan 250061，China

Received:2007-04-03 Revised:1900-01-01 Online:2007-12-24 Published:2007-12-24
Contact: YANG Min

摘要/Abstract

摘要： 为了在较低的连接温度、连接压力和连接时间下获得高温稳定性好的陶瓷/金属接头，通过设计非对称中间层（Cu，Nb）/Ni，在连接温度为1403K/1373K，连接时间为50min，连接压力为7.5MPa，冷却速度为10K/min的工艺条件下，采用真空扩散连接设备，进行了Si₃N₄/Inconel600高温合金接头的部分液相扩散连接（Partial Liquid Phase Diffusion Bonding，PLPDB）.接头的强度通过剪切试验评价，接头组织形态采用扫描电子显微镜（SEM）进行了观察和分析.实验结果表明，Cu，Nb配比、（Cu，Nb）层的厚度和连接温度影响接头的组织形态、强度与断裂.在连接温度为1403K时，Cu，Nb配比增加，接头中的孔洞缺陷减小，接头强度提高，断裂位置从陶瓷/中间层界面向陶瓷转变.当连接温度为1403K，Cu，Nb配比为10，(Cu,Nb)层厚度不超过0.2mm时，随着(Cu,Nb)层厚度的增加，接头强度提高.当连接温度从1403K降到1373K时，接头强度明显提高.

关键词: PLPDB, Si₃N₄陶瓷, Inconel 600高温合金, Cu, Nb配比, 连接温度

Abstract: In order to obtain ceramic/metal joint with excellent high temperature properties under lower bonding temperature, less bonding pressure and short bonding time, the partial liquid phase diffusion bonding (PLPDB) of Si₃N₄/Inconel 600 has been conducted in vacuum diffusing bonding machine through asymmetric interlayer design. The bonding time, pressure and cooling velocity were 50min, 7.5MPa and 10K/min, respectively, and the bonding temperature varied from 1373K to 1403K. While the strength of joint was evaluated by shear test, the microstructure of joint was observed and analyzed by scanning electron microscope. Results show that the thickness of (Nb，Cu) layer, the ratio of Cu to Nb and bonding temperature affect the microstructure, strength and fracture of joint. When the bonding temperature was 1403K, the increase of Cu to Nb ratio resulted in the reduction of porosities in joint, increase of joint strength and change of the fracture location from the interface between ceramic and interlayer to ceramic. When the bonding temperature is 1403K, the ratio of Cu to Nb is 10 and the thickness of (Cu,Nb) layer isless than 0.2mm, the strength of joint is raised while the thickness of (Cu, Nb) layer got thicker. The strength of joint rose obviously while the bonding temperature fell from 1403K to 1373K.

Key words: PLPDB, Si₃N₄ ceramics, Inconel600 high temperature alloy, ratio of Cu to Nb, bonding temperature

中图分类号:

TG454

杨敏,邹增大,宋文鹏,孙小磊 . Si₃N₄/（Cu，Nb）/Ni/Inconel600高温合金部分液相扩散连接接头的组织与力学性能[J]. 山东大学学报(工学版), 2007, 37(6): 36-40 .

YANG Min,ZOU Zeng-da,SONG Wen-peng,SUN Xiao-lei .

The mechanical characteristics and microstructure of the partial liquid phase diffusing bonding joint of Si₃N₄/(Cu,Nb)/Ni/Inconel600high temperature alloy

[J]. JOURNAL OF SHANDONG UNIVERSITY (ENGINEERING SCIENCE), 2007, 37(6): 36-40 .

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Si₃N₄/（Cu，Nb）/Ni/Inconel600高温合金部分液相扩散连接接头的组织与力学性能

The mechanical characteristics and microstructure of the partial liquid phase diffusing bonding joint of Si₃N₄/(Cu,Nb)/Ni/Inconel600high temperature alloy

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