Abstract:

In order to improve the high temperature resistant performance of traditional silicate inorganic adhesive, the new-type compound high temperature adhesive was prepared by sol-gel method with tetraethyl orthosilicate and zirconium oxychloride. Its thermal stability and bonding performance were studied by characterizing the structure, phase composition, heat change and appearance. The results showed that pH was of great influence on the sol-gel reaction process, and the optimal pH was 3. The preparation methods had obvious influence on the microstructure of SiO2-ZrO2 compound adhesive. Dispersion method was better than the in situ synthesis method for preparing the compound adhesive. The molar ratio of raw materials was an important influencing factor on the performance of the compound adhesive. The SiO2-ZrO2 compound adhesive could provide good bonding performance and good thermal stability when the Si-Zr molar ratio was 1∶3.

Key words: sol-gel method, Si sol, Zr sol, high temperature, compound adhesive